Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. This paper presents atomic density redistribution algorithm for predicting electromigration induced void nucleation and growth in solder joints of Chip Scale Package (CSP) structure. The driving force for electromigration induced failure considered here includes the electron wind force, stress gradients, temperature gradients, as well as the atomic density gradient, which were neglected in many of the existing studies on electromigration. The simulation results for void generation and time to failure (TTF) are discussed and correlated with the previous test results. EM sensitivity analysis is also performed to investigate the effect of EM parameters and mechanical properties of material on electromigration failure. The simulation results indicated that the atomic density on the activation energy is quite sensitive, and the mechanical material parameters have no impact on EM sensitivity of normalized atomic density.

Lihua Liang

Yuanxiang Zhang

Yong Liu

Journal of Electronic Packaging

《电子包装杂志》发表论文，使用实验和理论（分析和计算机辅助）方法、方法和技术来解决和解决分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题电子和光子元件、设备和系统。范围：微系统封装；系统集成；柔性电子；具有纳米结构和一般小规模系统的材料。

The Journal of Electronic Packaging, Transactions of the ASME publishes papers that employ experimental and theoretical (analytical and computer-aided) methods to address various mechanical, material, and reliability issues encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonic components, devices, and systems. The scope includes microsystem packaging, system integration, flexible electronics, and materials with nanostructures and general small-scale systems.

《Journal of Electronic Packaging, Transactions of the ASME》发表论文，采用实验和理论（分析和计算机辅助）方法，解决电子和光子元件、设备和系统在分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题。研究范围包括微系统封装、系统集成、柔性电子以及具有纳米结构和一般小规模系统的材料。

Category	Quartile
工程技术	4
工程技术, 工程电子与电气	4
工程技术, 工程机械	4

Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis

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Journal Info

Category	Quartile
ENGINEERING, MECHANICAL	2