Abstract Reliability risk in solder joints has been commonly linked to various failure mechanisms, with electromigration and fatigue among the prominent drivers. Even though these failure mechanisms often occur simultaneously, typical accelerated tests are based on a single failure mechanism. Consequently, the effect of multiple interacting failure mechanisms is ignored, which may underestimate reliability risk. This common practice has the potential to reduce life prediction accuracy. To address this gap, in this paper, we present an experimental set-up that is developed and used to simultaneously evaluate SAC 305 solder joint lifetime under electromigration and fatigue failure mechanisms using sequential and concurrent approaches. The sequential approach involves pre-stressing the solder joint using a fixed current density and temperature until the test vehicle attains a specified rise in resistance. After that, an isothermal fatigue load was applied at three prescribed temperatures. The data collected enables the estimation of parameters used for reliability prediction. On the other hand, the concurrent case involves the simultaneous application of current density, temperature, and cyclic mechanical load to the solder joint. The correlation of the experiment and complementary numerically simulated strain energy density resulted in an improved, physic-based reliability model, which has the added benefit of reduced time and cost of data collection, especially during new product development. Unlike the concurrent approach, the sequential approach shows a defect-driven failure mode. The prediction accuracy of the concurrent-based derived characteristic life model compared to that of experiment-derived characteristic life was found to be 25%.

Ekene Okafor

Collin Ruby

Mathew Norris

Andrew Leda

David Huitink

Journal of Electronic Packaging

《电子包装杂志》发表论文，使用实验和理论（分析和计算机辅助）方法、方法和技术来解决和解决分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题电子和光子元件、设备和系统。范围：微系统封装；系统集成；柔性电子；具有纳米结构和一般小规模系统的材料。

The Journal of Electronic Packaging, Transactions of the ASME publishes papers that employ experimental and theoretical (analytical and computer-aided) methods to address various mechanical, material, and reliability issues encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonic components, devices, and systems. The scope includes microsystem packaging, system integration, flexible electronics, and materials with nanostructures and general small-scale systems.

《Journal of Electronic Packaging, Transactions of the ASME》发表论文，采用实验和理论（分析和计算机辅助）方法，解决电子和光子元件、设备和系统在分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题。研究范围包括微系统封装、系统集成、柔性电子以及具有纳米结构和一般小规模系统的材料。

Category	Quartile
工程技术	4
工程技术, 工程电子与电气	4
工程技术, 工程机械	4

Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability

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Journal Info

Category	Quartile
ENGINEERING, MECHANICAL	2