Asia and South Pacific Design Automation Conference (ASP-DAC)

DeepIC3: Guiding IC3 Algorithms by Graph Neural Network Clause Prediction.

DeepIC3:通过图神经网络子句预测指导IC3算法。

2024

TransPlace: A Scalable Transistor-Level Placer for VLSI Beyond Standard-Cell-Based Design.

TransPlace:一种可扩展的晶体管级布局器,适用于超越标准单元设计的超大规模集成电路。

2024

PRESS: Persistence Relaxation for Efficient and Secure Data Sanitization on Zoned Namespace Storage : (Invited Paper).

PRESS:分区命名空间存储上高效安全数据清理的持久性松弛(特邀论文)。

2024

Physics-Informed Learning for Versatile RRAM Reset and Retention Simulation.

用于多功能RRAM复位和保持模拟的物理信息学习。

2024

Hard Error Correction in STT-MRAM.

STT-MRAM中的硬错误校正。

2024

An Optimization-aware Pre-Routing Timing Prediction Framework Based on Heterogeneous Graph Learning.

基于异构图学习的优化感知预布线时序预测框架。

2024

Verifying Embedded Graphics Libraries leveraging Virtual Prototypes and Metamorphic Testing.

利用虚拟原型和蜕变测试验证嵌入式图形库。

2024

On Decomposing Complex Test Cases for Efficient Post-silicon Validation.

高效后硅验证中复杂测试用例的分解研究。

2024

FuseFPS: Accelerating Farthest Point Sampling with Fusing KD-tree Construction for Point Clouds.

FuseFPS:通过融合KD树构建加速点云的最远点采样。

2024

RobustDiCE: Robust and Distributed CNN Inference at the Edge.

RobustDiCE:边缘的鲁棒和分布式CNN推理。

2024

会议信息

会议名称:

Asia and South Pacific Design Automation Conference

会议评级

CCF: C

CORE: C

THCPL: B

年度会议

Year: 2025

Place: Tokyo Odaiba Miraikan, Japan

Date: Jan 20-23, 2025

Timeline:

Abstract Deadline: N/A

Deadline: 2024-07-05T17:00:00-12:00

Abstract Deadline: N/A

Deadline: 2024-07-12T17:00:00-12:00

Year: 2024

Place: Sondo Convensia, Incheon, Korea

Date: Jan 22-25, 2024

Timeline:

Abstract Deadline: N/A

Deadline: 2023-07-28T17:00:00-12:00

Abstract Deadline: N/A

Deadline: 2023-08-04T19:00:00-12:00

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