Design Automation Conference (DAC)
Defending against Adversarial Patches using Dimensionality Reduction.
使用降维防御对抗性补丁。
2024
Ink: Efficient Incremental k-Critical Path Generation.
墨水:高效增量 k-关键路径生成。
2024
ALVEARE: a Domain-Specific Framework for Regular Expressions.
ALVEARE:一个用于正则表达式的领域特定框架。
2024
MTL-Split: Multi-Task Learning for Edge Devices using Split Computing.
MTL-Split:利用拆分计算实现边缘设备的多任务学习。
2024
Addition is Most You Need: Efficient Floating-Point SRAM Compute-in-Memory by Harnessing Mantissa Addition.
加法即所需:利用尾数加法实现高效的浮点数SRAM存内计算。
2024
Multi-order Differential Neural Network for TCAD Simulation of the Semiconductor Devices.
用于半导体器件TCAD仿真的多阶微分神经网络
2024
Partially-Structured Transformer Pruning with Patch-Limited XOR-Gate Compression for Stall-Free Sparse-Model Access.
带有补丁限制异或门压缩的部分结构化Transformer剪枝用于无停滞稀疏模型访问。
2024
Late Breaking Results: A real-time diffusion-based filter for human pose estimation on edge devices.
最新突破性结果:一种基于实时扩散的边缘设备人体姿态估计滤波器。
2024
Towards High-Performance Virtual Platforms: A Parallelization Strategy for SystemC TLM-2.0 CPU Models.
面向高性能虚拟平台:一种用于SystemC TLM-2.0 CPU模型的并行化策略。
2024
A Deep Reinforcement Learning based Online Scheduling Policy for Deep Neural Network Multi-Tenant Multi-Accelerator Systems.
基于深度强化学习的深度神经网络多租户多加速器系统在线调度策略。
2024
会议信息
会议名称:
Design Automation Conference
会议评级
CCF: A
CORE: A
THCPL: A
年度会议
Year: 2025
Place: San Francisco, CA
Date: June 22-25, 2025
Timeline:
Abstract Deadline: 2024-11-12T17:00:00-08:00
Deadline: 2024-11-19T17:00:00-08:00
Year: 2024
Place: San Francisco, CA
Date: June 23-27, 2024
Timeline:
Abstract Deadline: 2023-11-13T17:00:00-08:00
Deadline: 2023-11-20T17:00:00-08:00
Year: 2023
Place: San Francisco, CA
Date: July 9-13, 2023
Timeline:
Abstract Deadline: N/A
Deadline: 2022-11-14T17:00:00-08:00
Abstract Deadline: N/A
Deadline: 2022-11-21T17:00:00-08:00
Year: 2022
Place: San Francisco, CA
Date: July 10-14, 2022
Timeline:
Abstract Deadline: N/A
Deadline: 2021-11-15T17:00:00-08:00
Abstract Deadline: N/A
Deadline: 2021-11-22T17:00:00-08:00