ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA)
When to Stop? Towards Efficient Code Generation in LLMs with Excess Token Prevention.
何时停止?面向大语言模型中高效代码生成与超量令牌预防。
2024
CooTest: An Automated Testing Approach for V2X Communication Systems.
CooTest:一种用于V2X通信系统的自动化测试方法。
2024
Enhancing Robustness of Code Authorship Attribution through Expert Feature Knowledge.
通过专家特征知识增强代码作者归属的鲁棒性。
2024
FT2Ra: A Fine-Tuning-Inspired Approach to Retrieval-Augmented Code Completion.
FT2Ra:一种受微调启发的检索增强代码补全方法。
2024
Generalized Concurrency Testing Tool for Distributed Systems.
分布式系统的广义并发测试工具。
2024
An In-Depth Study of Runtime Verification Overheads during Software Testing.
软件测试中运行时验证开销的深入研究。
2024
Large Language Models Can Connect the Dots: Exploring Model Optimization Bugs with Domain Knowledge-Aware Prompts.
大型语言模型能够连接点:通过领域知识感知的提示探索模型优化漏洞。
2024
Towards More Complete Constraints for Deep Learning Library Testing via Complementary Set Guided Refinement.
通过互补集引导的细化实现更全面的深度学习库测试约束。
2024
Traceback: A Fault Localization Technique for Molecular Programs.
回溯法:一种用于分子程序的故障定位技术。
2024
Uncovering and Mitigating the Impact of Code Obfuscation on Dataset Annotation with Antivirus Engines.
揭示并缓解代码混淆对使用杀毒引擎进行数据集标注的影响。
2024
会议信息
会议名称:
ACM SIGSOFT International Symposium on Software Testing and Analysis
会议评级
CCF: A
CORE: A
THCPL: A
年度会议
Year: 2025
Place: Trondheim, Norway
Date: June 25-28, 2025
Timeline:
Abstract Deadline: N/A
Deadline: 2024-10-31T23:59:59-12:00
Year: 2024
Place: Vienna, Austria
Date: September 16-20, 2024
Timeline:
Abstract Deadline: N/A
Deadline: 2023-12-15T23:59:59-12:00
Abstract Deadline: N/A
Deadline: 2024-04-12T23:59:59-12:00
Year: 2023
Place: Seattle, United States
Date: July 17-21, 2023
Timeline:
Abstract Deadline: N/A
Deadline: 2022-11-10T23:59:59-12:00
Abstract Deadline: N/A
Deadline: 2023-02-16T23:59:59-12:00
Year: 2022
Place: Daejeon, South Korea
Date: July 18-22, 2022
Timeline:
Abstract Deadline: N/A
Deadline: 2022-01-28T23:59:59-12:00
Abstract Deadline: N/A
Deadline: 2022-01-31T23:59:59-12:00