This paper investigates the design of a typical commercially available drop system for generating very high shock and drop accelerations. Some commercially available drop towers produce accelerations greater than 5000 G by utilizing the dynamics of secondary impact, using an attachment termed a dual mass shock amplifier (DMSA). Depending on the design, some DMSAs are capable of repeatedly generating accelerations as high as 100,000 G. The results show that a finite element model (FEM) can capture the peak acceleration for the drop tower and the DMSA within 15%. In this paper, a detailed description of the test equipment and modeling techniques is provided. The effects of different design parameters, such as table mass, spring stiffness, and programmer material properties, on the drop profile, are investigated through parametric modeling. The effects of contact parameters on model accuracy are explored, including constraint enforcement algorithms, contact stiffness, and contact damping. Simple closed-form analytic models are developed, based on the basic principles of a single impact and the dynamics of secondary impact. Model predictions are compared with test results. Details of the test methodology and simulations guidelines are provided. Detailed finite element analysis (FEA) is conducted and validated against the experimental tests and compared to the simplified theoretical simulations. Benefits in exploring FEM to simulate contact between materials can be extrapolated to different architectures and materials such that with minimal experimental validation impact acceleration can be determined.

Stuart T. Douglas

Moustafa Al-Bassyiouni

Abhijit Dasgupta

Kevin Gilman

Aaron Brown

Journal of Electronic Packaging

《电子包装杂志》发表论文，使用实验和理论（分析和计算机辅助）方法、方法和技术来解决和解决分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题电子和光子元件、设备和系统。范围：微系统封装；系统集成；柔性电子；具有纳米结构和一般小规模系统的材料。

The Journal of Electronic Packaging, Transactions of the ASME publishes papers that employ experimental and theoretical (analytical and computer-aided) methods to address various mechanical, material, and reliability issues encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonic components, devices, and systems. The scope includes microsystem packaging, system integration, flexible electronics, and materials with nanostructures and general small-scale systems.

《Journal of Electronic Packaging, Transactions of the ASME》发表论文，采用实验和理论（分析和计算机辅助）方法，解决电子和光子元件、设备和系统在分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题。研究范围包括微系统封装、系统集成、柔性电子以及具有纳米结构和一般小规模系统的材料。

Category	Quartile
工程技术	4
工程技术, 工程电子与电气	4
工程技术, 工程机械	4

Simulation of Secondary Contact to Generate Very High Accelerations

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Journal Info

Category	Quartile
ENGINEERING, MECHANICAL	2