这本国际期刊提供重要、原创和及时研究的紧凑报告，反映了冶金、材料科学和工程（包括材料物理学、物理冶金和过程冶金）方面的进展。

Acta Metallurgica Sinica (English Letters) is an international journal that provides important, original, and timely research reports reflecting the latest advancements in metallurgy, materials science, and engineering, including materials physics, physical metallurgy, and process metallurgy.

《Acta Metallurgica Sinica (English Letters)》是一份国际期刊，提供重要、原创和及时的研究报告，反映冶金、材料科学和工程（包括材料物理学、物理冶金和过程冶金）领域的最新进展。

Acta Metallurgica Sinica (English Letters)

Xiaoliang Jia

Guhui Gao

Xiaolu Gui

Chun Feng

R. D. K. Misra

Bingzhe Bai

Uncovering Microstructure–Property Relationship in Ni-Alloyed Fe–Mn–Al–C Low-Density Steel Treated by Hot-Rolling and Air-Cooling Process

Lu Xiao

Ting-Ting Liu

Yue Chu

Bo Song

Jie Zhao

Xian-Hua Chen

Kai-Hong Zheng

Fu-Sheng Pan

Acta Metall. Sin. (Engl. Lett.)

Effect of Ti Particles on the Microstructure and Mechanical Properties of AZ91 Magnesium Matrix Composites

Ti颗粒对AZ91镁基复合材料微观结构和力学性能的影响

Yao-Zong Mao

Ying-Hua Wei

Hong-Tao Zhao

Chen-Xi Lv

Hai-Jiao Cao

Jing Li

Corrosion Behavior of Epoxy-Coated Rebar with Pinhole Defect in Seawater Concrete

Sn-Bi-X solders are widely used in electronic packaging industry. However, thermomigration (TM) behaviors of Sn-Bi-X solder joints and the orientations change of Bi grains under the temperature gradient are rarely reported. In this study, Sn-Bi57-Ag0.7/Cu solder joints were used to conduct a TM test under a temperature gradient of 625 °C/cm for 400 h, and an isothermal aging test at 85 °C was also conducted for comparison. The microstructural evolution of Sn-Bi-X solder joints after reflow, TM and isothermal aging were analyzed by scanning electron microscopy (SEM), transmission electron microscopy (TEM) and electron probe microanalysis (EPMA). The results indicated that the Sn/Bi areal ratio after TM did not change significantly whether at the hot end (from 46.78%/52.12% to 50.90%/48.78%) or at the cold end (from 50.25%/49.64% to 48.71%/51.16%) compared with that of as-reflowed samples due to the insufficient thermal energy. The thickness of intermetallic compound (IMC) after TM at hot end (2.49 μm) was very close to that of the IMC at cold end (2.52 μm), which was also close to that of the aged samples. In addition, the preferred orientations of Sn and Bi grains in different Sn–Bi–Ag solder joints resulting from different conditions (reflow, TM and isothermal aging) were characterized by electron backscatter diffraction (EBSD). The obtained results demonstrated that both Sn and Bi grains had no preferred orientation whether after reflow or isothermal aging, while the orientation of Bi grains of the sample after TM changed from random direction to c-axis ([0001] direction) parallel to the heat flow. Ag3Sn could hinder the change of orientation of Bi grains under the temperature gradient, and the corresponding mechanism was also systematically illuminated. This study firstly revealed the orientation change of Bi grains under the temperature gradient, which would have a profound guiding significance for enhancing the reliabilities of Sn–Bi–Ag solder joints.

Yinbo Chen

Zhaoqing Gao

Zhi-Quan Liu

Temperature Gradient Induced Orientation Change of Bi Grains in Sn–Bi57–Ag0.7 Solder Joint

温度梯度诱导Sn–Bi57–Ag0.7焊点中Bi晶粒取向变化

Friction stir processing (FSP) was used to modify the microstructure and improve the mechanical properties and corrosion resistance of an Mg–Al–Ca alloy. The results demonstrated that, after FSP, the grain size of the Mg–Al–Ca alloy was decreased from 13.3 to 6.7 μm. Meanwhile, the Al8Mn5 phase was broken and dispersed, and its amount was increased. The yield strength and ultimate tensile strength of the Mg–Al–Ca alloy were increased by 17.0% and 10.1%, respectively, due to the combination of fine grain, second phase, and orientation strengthening, while the elongation was slightly decreased. The immersion and electrochemical corrosion rates in 3.5 wt% NaCl solution decreased by 18.4% and 37.5%, respectively, which contributed to grain refinement. However, the stress corrosion cracking (SCC) resistance of the modified Mg–Al–Ca alloy decreased significantly, which was mainly due to the filiform corrosion induced by the Al8Mn5 phase. SCC was mainly controlled by anodic dissolution, while the cathodic hydrogen evolution accelerated the SCC process.

Wen Wang

Shan-Yong Chen

Ke Qiao

Pai Peng

Peng Han

Bing Wu

Chen-Xi Wang

Jia Wang

Yu-Hao Wang

Kuai-She Wang

Microstructure, Mechanical Properties, and Corrosion Behavior of Mg–Al–Ca Alloy Prepared by Friction Stir Processing

摩擦搅拌加工制备的Mg–Al–Ca合金的微观结构、力学性能和腐蚀行为

Pengpeng Chen

Hongyao Xie

Li-Dong Zhao

Recent Progress on Diamondoid Cu2SnSe3 Thermoelectric Materials: A Review

金刚烷型Cu2SnSe3热电材料近期进展：综述

Tianyi Zeng

Zirui Luo

Hao Chen

Wei Wang

Ke Yang

Flow Behavior and Dynamic Recrystallization Mechanism of CSS-42L Bearing Steel During Hot Compression Deformation

CSS-42L轴承钢在热压缩变形过程中的流动行为与动态再结晶机制

Yingying Fu

Zhihao Yao

Yang Chen

Hongying Wang

Yajing Li

Jianxin Dong

Progress in the Deposition Mechanisms and Key Performance Evaluation of Thermal Barrier Coatings for Turbine Blades: A Review

涡轮叶片热障涂层沉积机理及关键性能评价进展：综述

Jian Dong

Jufu Jiang

Ying Wang

Minjie Huang

Jingbo Cui

Tao Song

Effect of Solution and Aging Treatment on Microstructure and Mechanical Properties of Al–14Si–5Cu–1.1Mg–2.3Ni–0.3La Alloy

溶液和时效处理对Al–14Si–5Cu–1.1Mg–2.3Ni–0.3La合金微观结构和力学性能的影响

Xicheng Guan

Zhiyuan Liu

Ni Ma

Zhou Li

Juan Liu

Huiyan Zhang

Hailing Li

Qian Ba

Junjie Ma

Chuangui Jin

Ailin Xia

High-Performance p-Type Bi2Te3-Based Thermoelectric Materials with a Wide Temperature Range Obtained by Direct Sb Doping

通过直接Sb掺杂获得的高性能p型Bi2Te3基热电材料，具有宽温区特性

Abbreviation	Acta Metall. Sin. (Engl. Lett.)
Journal Impact	3.09
Quartiles(Global)	METALLURGY & METALLURGICAL ENGINEERING(Q2)

ISSN	1006-7191, 2194-1289
h-index	49

Publication Information	Publisher: Springer International Publishing AG，Publishing cycle: 12 issues per year，Journal Type: journal，Open Access Journals: No
Basic data	Year of publication: 1997，Proportion of original research papers: 96.40%，Self Citation Rate:17.20%， Gold OA Rate: 1.56%
Average review cycle	网友分享经验：较慢,6-12周
Average recruitment ratio	网友分享经验：容易

Acta Metallurgica Sinica (English Letters)

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