Microelectronics International
| 短名 | MI |
| Journal Impact | 0.61 |
| 国际分区 | MATERIALS SCIENCE, MULTIDISCIPLINARY(Q4) |
| 期刊索引 | SCI Q4中科院 4 区 |
| ISSN | 1356-5362, 1758-812X |
| h-index | 25 |
| 国内分区 | 工程技术(4区)工程技术工程电子与电气(4区)工程技术材料科学综合(4区) |
MICROELECTRONICS INTERNATIONAL 为与先进封装、微电路工程、互连、半导体技术和系统工程相关的研发、应用、工艺和当前实践提供了一个权威、国际和独立的论坛。它代表了当前、全面和实用的信息工具。编辑 JOHN ATKINSON 博士欢迎对该期刊的贡献，包括技术论文、研究论文、案例研究和发表的评论论文。有关详细信息，请查看作者指南。MICROELECTRONICS INTERNATIONAL 对与小型化电子设备和先进封装的设计、制造、组装和各种应用相关的关键技术和相关问题进行了多学科研究。涵盖的广泛主题包括：• 先进封装• 陶瓷• 芯片连接• 板上芯片(COB)• 芯片级封装• 柔性基板• MEMS• 微电路技术• 微电子材料• 多芯片模块(MCM)• 有机/聚合物电子• 印刷电子• 半导体技术• 固态传感器• 热管理• 厚/薄膜技术• 晶圆级加工。
期刊主页投稿网址| 涉及主题 | 工程类材料科学物理电气工程计算机科学量子力学化学光电子学复合材料纳米技术有机化学热力学冶金操作系统电信电子工程机械工程 |
| 出版信息 | 出版商: Emerald Group Publishing Ltd.，出版周期: Tri-annual，期刊类型: journal |
| 基本数据 | 创刊年份: 1982，原创研究文献占比: 96.88%，自引率:0.00%， Gold OA占比: 1.10% |
| 平均审稿周期 | 网友分享经验：>12周，或约稿 |
| 平均录用比例 | 网友分享经验：容易 |
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