Materials Science in Semiconductor Processing
短名 | Mater. Sci. Semicond. Process. |
Journal Impact | 4.29 |
国际分区 | PHYSICS, CONDENSED MATTER(Q2) |
期刊索引 | SCI Q2中科院 3 区 |
ISSN | 1369-8001, 1873-4081 |
h-index | 85 |
国内分区 | 工程技术(3区)工程技术工程电子与电气(3区)工程技术材料科学综合(3区)工程技术物理应用(3区)工程技术物理凝聚态物理(3区) |
半导体加工中的材料科学为讨论(光)电子学、传感器、检测器、生物技术和绿色能源的功能材料和设备的新型加工、应用和理论研究提供了一个独特的论坛。每期旨在提供当前的快照在微电子、能量转换和存储、通信、生物技术、(光)催化、纳米和薄膜技术、混合和复合材料、化学加工、气相沉积等不同领域的见解、新成就、突破和未来趋势、器件制造和建模,它们是先进半导体加工和应用的支柱。涵盖范围包括:用于亚微米器件的先进光刻技术;蚀刻和相关主题;离子注入;损害演变和相关问题;等离子体和热化学气相沉积;快速热处理;先进的金属化和互连方案;薄介电层,氧化;溶胶-凝胶加工;化学浴和(电)化学沉积;化合物半导体加工;新型非氧化物材料及其应用; (宏观)分子和杂化材料;分子动力学、从头算方法、蒙特卡洛等;分立和集成电路的新材料和新工艺;磁性材料和自旋电子学;异质结构和量子器件;半导体的电学和光学特性工程;晶体生长机制;可靠性、缺陷密度、固有杂质和缺陷。
期刊主页投稿网址涉及主题 | 材料科学物理量子力学化学工程类有机化学光电子学纳米技术复合材料冶金化学工程光学电气工程凝聚态物理生物热力学色谱法环境化学分析化学(期刊)结晶学图层(电子)物理化学地质学计算机科学薄膜生物化学 |
出版信息 | 出版商: Elsevier Ltd,出版周期: Bimonthly,期刊类型: journal |
基本数据 | 创刊年份: 1998,原创研究文献占比: 97.45%,自引率:4.80%, Gold OA占比: 5.21% |
平均审稿周期 | 网友分享经验:平均1.7个月来源Elsevier官网:平均3.7周 |
平均录用比例 | 网友分享经验:约88.33%来源Elsevier官网:15% |
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