IEEE Transactions on Device and Materials Reliability

短名IEEE Trans. Device Mater. Relib.
Journal Impact2.31
国际分区PHYSICS, APPLIED(Q2)
期刊索引SCI Q3中科院 3 区
ISSN1530-4388, 1558-2574
h-index79
国内分区工程技术(3区)工程技术工程电子与电气(3区)工程技术物理应用(3区)

本出版物的范围包括但不限于以下可靠性:设备、材料、工艺、接口、集成微系统(包括 MEMS 和传感器)、晶体管、技术(CMOS、BICMOS 等)、集成电路(IC、SSI , MSI, LSI, ULSI, ELSI, ETC.), 薄膜晶体管应用。从概念阶段到研发再到制造规模扩大的每个阶段对此类实体的可靠性的测量和理解,为设备、材料、工艺、封装和其他必需品的可靠性提供了整体数据库。将产品成功推向市场。该可靠性数据库是满足客户期望的优质产品的基础。如此开发的产品具有高可靠性。将实现高质量,因为将发现产品弱点(根本原因分析)并根据最终产品进行设计。这种不断提高可靠性和质量的过程将产生卓越的产品。最后,可靠性和质量不是一回事。但从某种意义上说,可以或必须做的一切都是为了保证产品在客户条件下在现场成功运行。我们的目标是抓住这些进步。另一个目标是在电子材料和设备的可靠性领域集中交叉交流,并提供对影响可靠性的基本现象的基本理解。此外,该出版物是可靠性跨学科研究的论坛。总体目标是提供前沿/最先进的信息,这与创建可靠的产品至关重要。

期刊主页投稿网址
涉及主题工程类物理材料科学电气工程量子力学计算机科学光电子学热力学电子工程化学电压复合材料有机化学功率(物理)纳米技术可靠性(半导体)电信冶金晶体管可靠性工程数学操作系统
出版信息出版商: Institute of Electrical and Electronics Engineers Inc.出版周期: Quarterly期刊类型: journal
基本数据创刊年份: 2001原创研究文献占比98.21%自引率:4.00%Gold OA占比: 24.52%
平均审稿周期 网友分享经验:较慢,6-12周
平均录用比例网友分享经验:较易

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