《电子包装杂志》发表论文，使用实验和理论（分析和计算机辅助）方法、方法和技术来解决和解决分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题电子和光子元件、设备和系统。范围：微系统封装；系统集成；柔性电子；具有纳米结构和一般小规模系统的材料。

The Journal of Electronic Packaging, Transactions of the ASME publishes papers that employ experimental and theoretical (analytical and computer-aided) methods to address various mechanical, material, and reliability issues encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonic components, devices, and systems. The scope includes microsystem packaging, system integration, flexible electronics, and materials with nanostructures and general small-scale systems.

《Journal of Electronic Packaging, Transactions of the ASME》发表论文，采用实验和理论（分析和计算机辅助）方法，解决电子和光子元件、设备和系统在分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题。研究范围包括微系统封装、系统集成、柔性电子以及具有纳米结构和一般小规模系统的材料。

Journal of Electronic Packaging, Transactions of the ASME

This paper investigates the design of a typical commercially available drop system for generating very high shock and drop accelerations. Some commercially available drop towers produce accelerations greater than 5000 G by utilizing the dynamics of secondary impact, using an attachment termed a dual mass shock amplifier (DMSA). Depending on the design, some DMSAs are capable of repeatedly generating accelerations as high as 100,000 G. The results show that a finite element model (FEM) can capture the peak acceleration for the drop tower and the DMSA within 15%. In this paper, a detailed description of the test equipment and modeling techniques is provided. The effects of different design parameters, such as table mass, spring stiffness, and programmer material properties, on the drop profile, are investigated through parametric modeling. The effects of contact parameters on model accuracy are explored, including constraint enforcement algorithms, contact stiffness, and contact damping. Simple closed-form analytic models are developed, based on the basic principles of a single impact and the dynamics of secondary impact. Model predictions are compared with test results. Details of the test methodology and simulations guidelines are provided. Detailed finite element analysis (FEA) is conducted and validated against the experimental tests and compared to the simplified theoretical simulations. Benefits in exploring FEM to simulate contact between materials can be extrapolated to different architectures and materials such that with minimal experimental validation impact acceleration can be determined.

Stuart T. Douglas

Moustafa Al-Bassyiouni

Abhijit Dasgupta

Kevin Gilman

Aaron Brown

Journal of Electronic Packaging

Simulation of Secondary Contact to Generate Very High Accelerations

次级接触生成极高加速度的模拟

Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. This paper presents atomic density redistribution algorithm for predicting electromigration induced void nucleation and growth in solder joints of Chip Scale Package (CSP) structure. The driving force for electromigration induced failure considered here includes the electron wind force, stress gradients, temperature gradients, as well as the atomic density gradient, which were neglected in many of the existing studies on electromigration. The simulation results for void generation and time to failure (TTF) are discussed and correlated with the previous test results. EM sensitivity analysis is also performed to investigate the effect of EM parameters and mechanical properties of material on electromigration failure. The simulation results indicated that the atomic density on the activation energy is quite sensitive, and the mechanical material parameters have no impact on EM sensitivity of normalized atomic density.

Lihua Liang

Yuanxiang Zhang

Yong Liu

Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis

焊点电迁移失效预测及其敏感性分析

Abstract This paper focuses on the validation of a brazed plate heat exchanger (BPHE) model that acts as the condenser of a novel in-rack cooling loop. In the proposed system, the primary fluid enters as a saturated vapor, while the secondary fluid enters as a sub-cooled liquid flowing in a counterflow configuration. The model augments an existing general technique for simplicity and computational efficiency and is applied to the condensation of a low-pressure, environmentally friendly refrigerant i.e., R1233zd(E). The model analyzes the heat transfer and pressure drop values of both fluids in the heat exchanger and uses these results to predict the heat exchanger duty and exit temperature and pressure of both fluids. The model predicts the values of fluid output properties along with heat exchanger duty to within 20% of experimental measurements. The validated model is then used to assess the magnitude of the heat transfer coefficient and friction factor attained on both fluid sides of the heat exchanger, including relatively uniform water-side heat transfer coefficient, a substantial (30%-80% of overall flow length) region of two-phase condensation, and a minimum refrigerant-side friction factor in the sub-cooled regime.

Rehan Khalid

Matt McMullen

Luca Amalfi

Dr. Alfonso Ortega

Aaron P. Wemhoff

Performance Analysis of a Brazed Plate Heat Exchanger during Condensation of R1233zd(E)

R1233zd(E)冷凝过程中钎焊板式换热器性能分析

Abstract There are numbers of through ceramic vias (TCVs) in ceramic package substrates for vertical interconnection of signal, and it would be very difficult, even impossible, to create the full wave 3D model of all TCVs during signal integrity (SI) analysis of a chip package. Thus, this paper presents a p-type equivalent circuit model for a signal TCV in steady of the full wave 3D model. To improve model accuracy, the model takes into account the parasitic inductance and resistance induced by the skin effect of TCV at high frequencies, as well as the parallel plate effect between multilayer ground plane. A more accurate calculation method of via-plate capacitance is proposed based on the quasi-static method. According to the Feature Selective Verification (FSV) method, the TCV S parameters calculated by the equivalent model and using the via-plate capacitance calculation method proposed in this study are in good consistency with those from HFSS full wave 3D model in a wideband, and the solution time is reduced by 98.85%.

Pan Ren

Chulin Wang

Yaya Liang

Xuan Zhao

Xiaojie Li

DU Pingan

Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate

陶瓷封装基板通孔的宽带等效电路建模与参数提取方法

Abstract Flexible hybrid electronics featuring wearable electronics offer numerous advantages such as function integration, light-weighting, and flexibility. However, the dynamic flexing of the flexible power sources during usage, along with flex-to-install, presents challenges for their durability. While previous research has focused on thick block batteries, the effects of daily motion-induced stresses on the state of health (SOH) degradation of thin-flexible batteries, in conjunction with usage parameters, are not well understood. Factors such as storage duration, operating temperature, flexing frequency, interval, and flex radius may vary, making it impractical and expensive to measure the battery response in every condition. Therefore, electrochemical simulation methods are necessary to predict the SOH degradation of the battery under various environmental conditions, which can assess conditions not previously measured. However, the degradation of the flexible battery is not only due to electrochemical aging but also mechanical aging. While electrochemical simulation is well-known, the effect of mechanical factors on degradation is relatively unknown. In this regard, this research seeks to make multi-physics simulations of SOH deterioration during charging/discharging of a flexible battery under dynamic folding, twisting, and static folding using a calendar-aged battery at elevated temperatures. Additionally, the method which is to link the mechanical simulation to electrochemical simulation was studied, which may be helpful in further understanding of unknown effects required for future study. The paper thoroughly discusses the developed model's capability to predict SOH degradation caused by mechanical stress and calendar aging. It also explores how accurately the model can illustrate degradation trends under various environmental conditions. The detailed results and their significance are presented comprehensively, providing a clear understanding of the model's effectiveness within the context of the study.

Pradeep Lall

Hyesoo Jang

Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging

用于评估动态弯曲和日历老化下薄型柔性锂离子电池健康状态的电化学与机械模拟

Abstract Reliability risk in solder joints has been commonly linked to various failure mechanisms, with electromigration and fatigue among the prominent drivers. Even though these failure mechanisms often occur simultaneously, typical accelerated tests are based on a single failure mechanism. Consequently, the effect of multiple interacting failure mechanisms is ignored, which may underestimate reliability risk. This common practice has the potential to reduce life prediction accuracy. To address this gap, in this paper, we present an experimental set-up that is developed and used to simultaneously evaluate SAC 305 solder joint lifetime under electromigration and fatigue failure mechanisms using sequential and concurrent approaches. The sequential approach involves pre-stressing the solder joint using a fixed current density and temperature until the test vehicle attains a specified rise in resistance. After that, an isothermal fatigue load was applied at three prescribed temperatures. The data collected enables the estimation of parameters used for reliability prediction. On the other hand, the concurrent case involves the simultaneous application of current density, temperature, and cyclic mechanical load to the solder joint. The correlation of the experiment and complementary numerically simulated strain energy density resulted in an improved, physic-based reliability model, which has the added benefit of reduced time and cost of data collection, especially during new product development. Unlike the concurrent approach, the sequential approach shows a defect-driven failure mode. The prediction accuracy of the concurrent-based derived characteristic life model compared to that of experiment-derived characteristic life was found to be 25%.

Ekene Okafor

Collin Ruby

Mathew Norris

Andrew Leda

David Huitink

Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability

组合应力焊点可靠性的顺序效应与并发效应

Abstract Traditionally, Data Centers (DC) have used air cooling for IT equipment, but as Graphics Processing Units (GPUs) evolve, they demand more power and sophisticated cooling. Aiming for efficiency, Direct Liquid Cooling (DLC) emerges as a promising solution. We evaluated the effectiveness of DLC versus traditional air cooling on a Microsoft G50 GPU server performing AI/ML tasks. The results indicated that DLC greatly enhances GPU performance, increases efficiency by 2.7% in Gflops/s, cuts power usage by 12%, reduces execution times by up to 6.22%, and lowers chip temperatures by 20° compared to air cooling. Our research develops an overall performance metric that considers data center, hardware, and chip levels, concluding that DLC is extremely beneficial for AI workloads, increasing energy savings and balancing performance with power requirements.

Bharath Ramakrishnan

Cam Turner

Husam Alissa

Dennis Trieu

Felipe Rivera

Luke Melton

Muralikrishna Rao

Sruti Chigullapalli

Tatek Getachew

Vladimir Prodanovic

Robert Lankston

Christian Belady

Vaidehi Oruganti

Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads

理解数据中心液冷对机器学习和人工智能工作负载的能效与性能影响

Abbreviation	J. Electron. Packag.
Journal Impact	2.38
Quartiles(Global)	ENGINEERING, MECHANICAL(Q2)

ISSN	1043-7398, 1528-9044
h-index	60

Publication Information	Publisher: The American Society of Mechanical Engineers(ASME)，Publishing cycle: Quarterly，Journal Type: journal，Open Access Journals: No
Basic data	Year of publication: 1989，Proportion of original research papers: 93.51%，Self Citation Rate:9.10%， Gold OA Rate: 0.57%
Average review cycle	网友分享经验：>12周，或约稿
Average recruitment ratio	网友分享经验：容易

Journal of Electronic Packaging, Transactions of the ASME

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Simulation of Secondary Contact to Generate Very High Accelerations

Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis

Performance Analysis of a Brazed Plate Heat Exchanger during Condensation of R1233zd(E)

Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate

Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging

Performance Analysis of a Brazed Plate Heat Exchanger during Condensation of R1233zd(E)

Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate

Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging

Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability

Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads