Journal of Electronic Packaging, Transactions of the ASME
| 短名 | J. Electron. Packag. |
| Journal Impact | 2.38 |
| 国际分区 | ENGINEERING, MECHANICAL(Q2) |
| 期刊索引 | SCI Q4中科院 4 区 |
| ISSN | 1043-7398, 1528-9044 |
| h-index | 60 |
| 国内分区 | 工程技术(4区)工程技术工程电子与电气(4区)工程技术工程机械(4区) |
《电子包装杂志》发表论文，使用实验和理论（分析和计算机辅助）方法、方法和技术来解决和解决分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题电子和光子元件、设备和系统。范围：微系统封装；系统集成；柔性电子；具有纳米结构和一般小规模系统的材料。
期刊主页投稿网址| 涉及主题 | 材料科学工程类物理热力学复合材料量子力学化学机械工程电气工程计算机科学地理气象学冶金机械有机化学物理化学结构工程纳米技术操作系统热的数学光电子学传热焊接电信地质学生物哲学 |
| 出版信息 | 出版商: The American Society of Mechanical Engineers(ASME)，出版周期: Quarterly，期刊类型: journal |
| 基本数据 | 创刊年份: 1989，原创研究文献占比: 93.51%，自引率:9.10%， Gold OA占比: 0.57% |
| 平均审稿周期 | 网友分享经验：>12周，或约稿 |
| 平均录用比例 | 网友分享经验：容易 |
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